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    全自動硅片下料機

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    設備名稱 Equipment Name

    全自動硅片下料機  Automatic Wafer Unloader

    設備型號 Equipment Model

    DP-Ⅲ/LXP-Ⅲ

    設備用途 Equipment Application

    DP-Ⅲ:將上⼀道工序片籃中的硅片自動裝入下⼀道工序片籃中。
    DP-III:Transfer wafers from the cassette of the previous process to the cassette of next process.

    LXP-Ⅲ:將5道/8道/10道在線鏈式清洗設備中生産的硅片導入片籃。
    LXP-III:Unloading the wafers from the 5/8/10-lane inline cleaning equipment to cassettes. 


    技術特點  Features

    DP-III

    1. 采用PLC控制,下片過程全自動完成;觸摸屏菜單操作,簡單明了。
    With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

    2. 采用單道下片方式,保證下片生産率,同時滿足硅片按批次⽣産的要求。
    With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

    3. 采用雙工位操作換片籃不停機。
    Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

    4. 在線式/離線式可選。
    Inline/Offline optional.

    5. 匹配AGV, RFID, MES 管理功能。
    Compatible with AGV, RFID, MES function optional.

      




    LXP-III 
    1. 采用PLC控制,下片過程全自動完成;觸摸屏菜單操作,簡單明了。
    With PLC control and the unloading process is completed automatically; Touch-screen operation, which is easy and clear.

    2. 可對硅片進入下片機前進行破片檢測和破片處理。(此功能需另外訂購,標准機無此功能)
    Breakage detection and treatment before wafer unload to the unloader. (Extra charges )

    3. 翻轉功能,稱重測試功能(此功能需另外訂購,標准機無此功能)。
    Wafer turnover function, Weight testing function (need extra charges, standard equipment without this configuration)

    4. 匹配AGV,RFID,MES管理功能。
    Compatible with AGV,RFID, MES management function.

    設備參數  Parameters