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全自動硅片上料機

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設備名稱 Equipment Name
· 全自動硅片上料機  Automatic Wafer Loader

設備型號 Equipment Model
· ZP-Ⅲ/LSP-Ⅱ

設備用途 Equipment Application

ZP-Ⅲ :
· 將堆疊的硅片自動裝入片籃中,並將片籃自動送入下一道工序使用。
  Load the stacked wafers into cassette and transport the cassette to next process step automatically.

LSP-Ⅱ:
· 將片籃中的硅片自動裝載到5道/8道/10道在線鏈式清洗設備中。
  Load the wafers in the cassette to the 5-lane/8-lane/10-lane inline cleaning equipment automatically.

技術特點  Features

ZP-III

· 采用PLC控制,上片過程全自動完成;觸摸屏菜單操作,簡單明了。
  With PLC control and the loading process is completed automatically; Touch-screen operation, which is easy and clear.

· 裝片采⽤雙工位模式,提⾼了工作效率。
  With double workstations improve the working efficiency.

· 具有雙片檢測、上料位有無硅片檢測、片盒定位檢測等功能。
  With overlapping detection, loading station with/ without wafer detection, cassette positioning and monitoring fuction etc.

· 在線式/離線式可選。
  Inline/Offline optional.

· 匹配AGV, RFID,MES 管理功能。
  Compatible with AGV, RFID, MES function.

LSP-II

· 采用PLC控制,上片過程全自動完成,觸摸屏菜單操作,簡單明了。
  With PLC control and the loading process is completed automatically,Touch-screen operation, which is easy and clear.

· 采用單道上片方式,保證上片生産率,同時滿⾜硅片按批次生産的要求。
  With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

· 采用雙工位操作換片籃不停機。
  Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

· 可對硅片進入下片機前進行破片檢測和破片處理。(此功能客戶需另外訂購,標准機無此功能)。
  Wafer breakage detection and broken wafer treatment before transfering to the unloader (need extra charges, standard equipment without this configuration).

· 匹配AGV,RFID,MES管理功能。
  Compatible with AGV, RFID, MES function. 

設備參數  Parameters